Wang Yuming
Senior Engineer
Director of SMT Laboratory
Email: wangyuming@tsinghua.edu.cn
1. Education Experience
August 1979 – July 1983, Bachelor’s Degree in Radio Equipment Structure, Department of Electronics and Mechanics, Northwest Institute of Telecommunication Engineering (now Xi’an University of Electronic Science and Technology).
2. Work Experience
March 2006 to present, Senior Engineer, Director of Tsinghua-SMT Laboratory, Fundamental Industry Training Center, Tsinghua University.
2002.11-2006.2, Senior Engineer, Tsinghua-Weichuangli SMT Laboratory Director, Tsinghua University Science and Education Instrument Factory
1997.7-2002.10 Supervisor of Technology and External Cooperation, Tsinghua Tongfang Co., Ltd. control product company.
1993.3-1997.7 Senior Engineer, Manager of Technology Department, Production and Processing Center, Sixth Research Institute, Ministry of Electronics.
1983.8-1993.2 Engineer and Product Technician, Electronic Technological Institute 710 Factory, Ministry of Electronic Industry.
3. Research Area
1. Electronic technology, focusing on surface mounting technology, PCB manufacturability design and so on.
Has rich practical experience, 35 years of electronic process work experience and more than 20 years of SMT process work experience. Familiar with SMT equipment, process and design, good at SMT process research, PCB shape design, pad design, especially BGA components pad design, process layout, process requirements have rich practical experience.
2. Reliability research of electronic products, focusing on solder joint reliability, PCB reliability design and so on.
Reliability analysis and consultation for aerospace, aviation and military enterprises, such as the Fifth Academy of Aerospace, the Seventh Academy of Aerospace, the Chinese Academy of Aviation Research, the China Electronic Science and Technology Group Corporation, etc.
Provides reliability solution for private enterprises such as the Sifang Vehicle Research Institute of Qingdao and the Photoelectric Research Institute of the Chinese Academy of Sciences. And for foreign companies such as Samsung headquarters in Korea, AP Company in the United States, Taiwan Morse Co., Ltd.
4. Honors and Awards
1. In 1996, advanced technologist by the Ministry of Electronics.
2. In 2000, advanced worker by Tsinghua Tongfang
3. 2003 Advanced Workers of Fundamental Industry Training Center of Tsinghua University
4. 2009. 23rd Award for Benefit in Use of Large-scale Instruments and Equipment
5. In 2010, 11th Experimental Technology Achievement Award of Tsinghua University.
6. In 2010, Excellent Laboratory Technician of Tsinghua University.
5. Selective Publications
“The Research of Interface crack of Solder Joint and Solderability of Components, printed circuit board”， ICEPT-HDP2012 International Conference(IEEE)，2012.8，Wang Yuming.
“DFM of Soldering Pad of QFP and DIP for Wave Soldering”，《ICEPT-HDP2013 International Conference(IEEE) 》，Wang Yuming.
“How to Develop the Practice Teaching of SMT”, International Conference，Wang Yuming.
“Research on Factors Influencing the Board Level Product Quality ” ，《ICEPT-HDP2014 International Conference(IEEE) 》，2014.8，Wang Yuming.
“Model Building of Printed Circuit Board and Failure Analysis of Solder Joint ”, ICEPT-HDP2015International Conference，2015，Wang Yuming.
“Failure analysis and solution for PCBA solder joint”, 3rd International Conference on Nanojoining and Microjoining, Ontario”， Wang Yuming ,Canada. 2016,September 25-28.
Textbooks
1. Surface Mounting Machine and Its Application, Wang Tianxi, Wang Yuming, October 2011
2. Modern Electronic Technology, Tsinghua University Press, Wang Tianxi, Wang Yuming, 2009.9
3. Modern Electronic Manufacturing, Tsinghua University Press, Wang Tianxi, Wang Yuming, 2010.11
4. Electronic Assembly Manufacturing – Chips, Circuit Boards, Packaging and Components (USA) C.A. Harper, Jia Songliang, Cai Jian, Wang Yuming et al. Translated 2005.2
