Wang Beibei
Engineeer
Deputy Director of Electronic Technology Laboratory
Email: beibei1203@sina.com
1. Education Experience
2012/09-2014/06 Master of Software Engineering, Tianjin University
1999/09-2003/07 Bachelor of Communications Engineering, Chongqing Communication College
2. Work Experience
2003/08-present Deputy Director Engineer, Electronic Technology Laboratory, Fundamental Industry Training Center, Tsinghua University
3. Research Area
Mainly engaged in research work in the field of electronic technology. Participated in 10 scientific research projects, including one major national science and technology project.
4. Honors and Awards
In 2006, “Practical Teaching Platform of Electronic System Hardware Design and Production” won the first prize of the 9th “Tsinghua University Experimental Technology Achievement Award”.
In 2008, “Training and Practice Teaching Platform of New Electronic Information Technology Project” won the second prize of the tenth “Tsinghua University Experimental Technology Achievement Award”.
In 2010, “Electronic Engineering Practice Teaching Platform Construction” won the second prize of the 11th “Tsinghua University Experimental Technology Achievement Award”.
In 2010, “THDAQ-VLAB Virtual Instrument Innovation Practice Teaching Platform” won the third prize of the 11th “Tsinghua University Experimental Technology Achievement Award”.
In 2016, “Multi-module EDA Practical Teaching Platform for Teaching Students in accordance with Their aptitude” won the second prize of the 14th “Tsinghua University Experimental Technology Achievement Award”.
In 2016, “Experimental Innovation Teaching Platform Based on Cloud Computing Platform” won the third prize of the 14th “Tsinghua University Experimental Technology Achievement Award”.
In 2018, “Basic Industry Cloud Service Platform” won the first prize of the 15th “Tsinghua University Experimental Technology Achievement Award”.
In 2018, “Electronic Practice Teaching Platform for Prototype Manufacturing Based on Liquid Metals” won the third prize of the 15th “Tsinghua University Experimental Technology Achievement Award”.
5. Selective Publications
Yuming Wang，Beibei Wang，Jian Cai , Tianxi Wang；Impact of Soldering Terminal Solderability of Component and PCB on Solder Joint Interface；2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)；IEEE ID D-4，2012.08
